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INTEGRATED CIRCUITS
DATA SHEET
SAA5191 Teletext video processor
Preliminary specification File under Integrated Circuits, IC02 March 1991
Philips Semiconductors
Preliminary specification
Teletext video processor
SAA5191
FEATURES * Adaptive data slicer * Crystal-controlled data clock regeneration with a bit rate of 6.9375 MHz * Adaptive sync separator, horizontal phase detector and 13.5 MHz VCO to provide display phase locked loop (PLL) * TV synchronization at teletext mode
GENERAL DESCRIPTION The SAA5191 is a bipolar integrated circuit that extracts teletext data from the video signal (CVBS), regenerates the teletext clock (TTC) and synchronizes the text display to the television signals (VCS). This device operates in conjunction with the Digital Video Teletext (back-end) Decoder (DVTB - SAA9042A) or any other compatible device.
QUICK REFERENCE DATA SYMBOL VP IP Vi CVBS supply current CVBS input signal on pin 27 (peak-to-peak value) at pin 2 LOW at pin 2 open-circuit Vo VF13 VSYNC VCS outputs signals TTC and TTD (peak-to-peak value, pins 14, 15) 13.5 MHz clock output signal (peak-to-peak value pin 17) SYNC output signal TCS video composite sync level on output pin 25 LOW HIGH Tamb operating ambient temperature - 2.4 0 - - - 0.4 5.5 +70 V V C - - 2.5 1 1 2.5 3.5 2 - 450 - - 4.5 3 1 650 V V V V V mV PARAMETER supply voltage (pin 16) - - MIN. TYP. 12 70 - - MAX. V mA UNIT
video sync output signal (peak-to-peak value, pin 1) - 200
ORDERING AND PACKAGE INFORMATION EXTENDED TYPE NUMBER SAA5191 Note 1. SOT117-1;1996 November 14 28 PACKAGE PINS DIL PIN POSITION MATERIAL plastic CODE SOT117(1)
March 1991
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March 1991
handbook, full pagewidth
VP PL CBB VP +12 V 21 19 17 F13 (13.5 MHz clock) 20 18 16
Philips Semiconductors
VCS
25
24
23
22
10
TCS PULSE GENERATOR VCO
Teletext video processor
28 HORIZONTAL PHASE DETECTOR
SENSE "NO INPUT"
SAA5191
LATCHES ADAPTIVE DATA SLICER
15
TTD (data)
composite video input DUAL POLARITY BUFFER CLOCK PHASE DETECTOR
27
ADAPTIVE SYNC SEPARATOR
26 SENSE "NO LOAD" SENSE EXTERNAL DATA
14
TTC (clock)
3
HF LOSS COMPENSATOR 3 4 1 5 6 8 7 9 VP set sync polarity data input
PHASE SHIFTER
12
GAIN SWITCH
OSCILLATOR DIVIDER BY 2 11 XTAL 13.875 MHz 13 GND
VP
2
set video input level
MEH149
sync output
Preliminary specification
SAA5191
Fig.1 Block diagram.
Philips Semiconductors
Preliminary specification
Teletext video processor
PINNING SYMBOL STTV VILS Cfilt Cstore Campl Czero EXD Ctime CCLK CBB XTAL CLF GND TTC TTD VP F13 OSCO CVCR OSCI Chor PL RT CT VCS CBL CVBS TCS Notes 1. Sliced teletext data from external: active HIGH level (current), low impedance input. 2. While the loop is locking up. PIN 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 DESCRIPTION sync output signal to TV (positive or negative going) level select input of video input (LOW equals 1 V) video filtering capacitor of HF loss compensation HF storage capacitor amplitude capacitor zero level capacitor external data current input (note 1) data timing capacitor for the adaptive data slicer clock phase detector capacitor blanking insertion input 13.875 MHz crystal (double of data rate) 6.9375 MHz clock frequency filter ground (0 V) teletext clock output (for computer controlled teletext) teletext data output (for computer controlled teletext) +12 V supply voltage 13.5 MHz VCO output (for sandcastle generation) oscillator output to series LC-circuit or crystal short time constant capacitor at video recorder mode (note 2) oscillator input from series LC-circuit or crystal horizontal phase capacitor / VCR mode sandcastle input (generated in CCT) timing resistor for pulse generator timing capacitor for pulse generator video composite sync output to CCT black level capacitor composite video input signal from TV text-composite/scan-composite sync input (TSC/SCS)
fpage
SAA5191
PIN CONFIGURATION
STTV 1 VILS 2 Cfilt 3 Cstore 4 Campl 5 Czero 6 EXD 7
28 TCS 27 CVBS 26 CBL 25 VCS 24 CT 23 RT 22 PL
SAA5191
Ctime 8 CCLK 9 CCB 10 XTAL 11 CLF 12 GND 13 TTC 14
MEH150
21 Chor 20 OSCI 19 CVCR 18 OSCO 17 F13 16 VP 15 TTD
Fig.2 Pin configuration.
March 1991
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Philips Semiconductors
Preliminary specification
Teletext video processor
LIMITING VALUES In accordance with the Absolute Maximum System (IEC 134). SYMBOL VP V5 Tstg Tamb voltage on pin 5 storage temperature range operating ambient temperature range PARAMETER supply voltage (pin 16) 0 0 -20 0 MIN.
SAA5191
MAX. 13.2 5.5 125 +70 V V
UNIT
C C
CHARACTERISTICS VP = 12 V; Tamb = 25 C and measurements taken in Fig.3, unless otherwise specified. SYMBOL VP IP Vi CVBS PARAMETER supply voltage range (pin 16) supply current ZS 250 V2 = LOW V2 = HIGH sync amplitude (peak-to-peak value) data slicing level V2 I2 input voltage LOW (pin 2) input voltage HIGH input current LOW input current HIGH Teletext data output (TTD) V22 phase lock pulse (PL) input voltage (peak-to-peak value, pin 22) data output signal on pin 15 (peak-to-peak value) DC output voltage load capacitance on pin 15 rise and fall time mean level phase locked phase unlocked Vo TTD V15 CL t r, t f Vo TTC V14 CL t r, t f td 0 3.9 2.5 3 - 20 - - 3.5 4 - 30 3 5.5 4.5 5 40 45 V V V V pF ns V2 < 5.5 V V2 = LOW V2 = HIGH 0.7 1.75 0.1 0.3 0.75 0 open-circuit equals HIGH 2.0 0 0 1 2.5 - 0.46 1.15 - - - - 1.4 3.5 1 0.7 1.75 0.8 5.5 -150 1 V V V V V V V A mA CONDITIONS MIN. 10.8 50 TYP. 12.0 70 MAX. 13.2 105 UNIT V mA
Video input, sync separator and data slicer input signal sync to white (peak-to-peak value, pin 27)
Teletext clock output (TTC) clock output signal on pin 14 (peak-to-peak value) DC output voltage load capacitance on pin 14 rise and fall time delay time of falling edge relative to other edges of TTD mean level 2.5 3 - 20 - 3.5 4 - 30 - 4.5 5 40 45 20 V V pF ns ns
March 1991
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Philips Semiconductors
Preliminary specification
Teletext video processor
SAA5191
SYMBOL
PARAMETER
CONDITIONS
MIN.
TYP. - - - - -70 - - 450 1.4 10.1 - - - - - 350 - - - 2 - - -
MAX.
UNIT
Text/ scan composite sync input (TCS/SCS) V28 input voltage LOW for TCS (pin 28) input voltage HIGH for TCS input voltage LOW for SCS input voltage HIGH for SCS I28 input current V28 = 0 to 7 V V28 = 10 to VP SYNC output buffer Vo CVBS sync output signal on pin 1 (peak-to-peak value) TCS output signal V1 I1 V25 I25 td V10 I10 Vo V17 CL t r, t f DC output voltage at positive sync signal DC output voltage at negative sync signal output current Video composite sync output (VCS) output voltage LOW (pin 25) output voltage HIGH output current LOW output current HIGH sync separator delay time Horizontal phase detector and 13.5 MHz VCO input voltage LOW (CBB), pin 10 blanking insertion HIGH input current 13.5 MHz clock output signal (peak-to-peak value, pin 17) DC output voltage load capacitance on pin 17 rise and fall time maximum swing blanking inserted no blanking 0 1.0 - 1 4 - 10 0.5 5.5 -5 3 8.5 40 30 V V A V V pF ns 0 2.4 0 0 250 0.4 5.5 0.5 -1.5 400 V V mA mA ns RL 1 = 1.2 k to VP RL 1 = 1.2 k to GND RL 1 = 1.2 k to GND RL 1 = 1.2 k to VP - 200 1.0 9.0 - 1 650 2.0 11.0 3 V mV V V mA 0 2.0 0 3.5 -40 - 0.8 7.0 1.5 7.0 -100 5 V V V V A A
March 1991
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Philips Semiconductors
Preliminary specification
Teletext video processor
SAA5191
handbook, full pagewidth
47 F
47 nF
82
47 nF +12 V
3.3 k 47 nF
15 F
22 nF
VP = 12 V
TCS PL VCS 1 nF 470 2.2 F CVBS 28 27 26 68 nF 25 24 220 pF 23 68 k 15 H
(1) (2)
F13 6.8 pF 20 19 18 17 16 15
(4)
10 nF TTD
22
21
SAA5191 1.2 k sync 1 2 3 15 pF 4 1 nF 5 470 pF 6 22 nF 7 8 270 pF 9 100 pF 10 11 12 13 14
27 pF
15 H
1.2 k
video input level select
XTAL
(3)
13.875 MHz 15 pF
TTC
data input
CBB
XTAL additional drawing for crystal application 47 nF 21 13.5 MHz 20
(2)
MEH156
47 nF 19 18
22 pF
SAA5191
(1) inductance 15 H at 1 kHz, Co = 2.2 pF. Adjust free-running frequency to 13.5 0.1 MHz or apply 13.5 MHz quartz crystal as shown in additional drawing (2) Crystal: f = 13.5 MHz (e.g. Philips catalogue number 4322 143 04101); adjustment tolerance 40 x 10-6; load capacitance CL = 22 pF; resonance resistance Rr = 22 pF; typical motional capacitance C1 = 23 fF; static parallel capacitance C0 = 5.5 pF; frequency tolerance 30 x 10-6 in temperature range T = -20 to +70. Adjust free-running frequency to 13.5 0.5 MHz. (3) Crystal: f = 13.875 MHz; adjustment tolerance 40 x 10-6; load capacitance CL = 15 pF; typical resonance resistance Rr = 15 (maximum 60 ); typical motional capacitance C1 = 19 fF; static parallel capacitance Co = 5 pF; frequency tolerance 30 x 10-6 in temperature range T = -20 to +70. (4) Coil: Fixed inductance 15 H 20%, quality factor Q > 20.
Fig.3 Test circuit and application circuit using LC-circuit or a crystal for VCO (clock F13).
March 1991
7
Philips Semiconductors
Preliminary specification
Teletext video processor
PACKAGE OUTLINE
handbook, plastic dual in-line package; 28 leads (600 mil) DIP28: full pagewidth
SAA5191
SOT117-1
seating plane
D
ME
A2
A
L
A1 c Z e b1 b 28 15 MH wM (e 1)
pin 1 index E
1
14
0
5 scale
10 mm
DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT mm inches A max. 5.1 0.20 A1 min. 0.51 0.020 A2 max. 4.0 0.16 b 1.7 1.3 0.066 0.051 b1 0.53 0.38 0.020 0.014 c 0.32 0.23 0.013 0.009 D (1) 36.0 35.0 1.41 1.34 E (1) 14.1 13.7 0.56 0.54 e 2.54 0.10 e1 15.24 0.60 L 3.9 3.4 0.15 0.13 ME 15.80 15.24 0.62 0.60 MH 17.15 15.90 0.68 0.63 w 0.25 0.01 Z (1) max. 1.7 0.067
Note 1. Plastic or metal protrusions of 0.25 mm maximum per side are not included. OUTLINE VERSION SOT117-1 REFERENCES IEC 051G05 JEDEC MO-015AH EIAJ EUROPEAN PROJECTION
ISSUE DATE 92-11-17 95-01-14
March 1991
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Philips Semiconductors
Preliminary specification
Teletext video processor
SOLDERING Introduction
SAA5191
There is no soldering method that is ideal for all IC packages. Wave soldering is often preferred when through-hole and surface mounted components are mixed on one printed-circuit board. However, wave soldering is not always suitable for surface mounted ICs, or for printed-circuits with high population densities. In these situations reflow soldering is often used. This text gives a very brief insight to a complex technology. A more in-depth account of soldering ICs can be found in our "IC Package Databook" (order code 9398 652 90011). Soldering by dipping or by wave The maximum permissible temperature of the solder is 260 C; solder at this temperature must not be in contact with the joint for more than 5 seconds. The total contact time of successive solder waves must not exceed 5 seconds. The device may be mounted up to the seating plane, but the temperature of the plastic body must not exceed the specified maximum storage temperature (Tstg max). If the printed-circuit board has been pre-heated, forced cooling may be necessary immediately after soldering to keep the temperature within the permissible limit. Repairing soldered joints Apply a low voltage soldering iron (less than 24 V) to the lead(s) of the package, below the seating plane or not more than 2 mm above it. If the temperature of the soldering iron bit is less than 300 C it may remain in contact for up to 10 seconds. If the bit temperature is between 300 and 400 C, contact may be up to 5 seconds. DEFINITIONS Data sheet status Objective specification Preliminary specification Product specification Limiting values Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information Where application information is given, it is advisory and does not form part of the specification. LIFE SUPPORT APPLICATIONS These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such improper use or sale. This data sheet contains target or goal specifications for product development. This data sheet contains preliminary data; supplementary data may be published later. This data sheet contains final product specifications.
March 1991
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